MOLYKOTE® 340 Silicone Heat Sink Compound is engineered to facilitate effective thermal management in electronic assemblies. Its grease-like consistency, combined with thermally conductive metal oxide fillers, ensures optimal heat transfer from heat-generating components to heat sinks or chassis, thereby enhancing device reliability and longevity.

Key Features:

• Thermally Conductive: Efficiently transfers heat away from electronic components.

• Non-Curing & Non-Flowing: Maintains its consistency over time without hardening or flowing.

• High Temperature Stability: Performs reliably across a broad temperature range.

• Low Bleed & Evaporation: Minimizes the risk of contamination and maintains performance.

• Excellent Dielectric Properties: Provides electrical insulation in addition to thermal conductivity.

Typical Applications:

• Thermal coupling of transistors, diodes, and silicon-controlled rectifiers to heat sinks.

• Enhancing heat dissipation in power supplies, amplifiers, and electronic modules.

• Used in aerospace, automotive, and industrial electronic assemblies requiring efficient thermal management.

Technical Specifications:

• Color: White

• Consistency: Grease-like

• Specific Gravity: 2.1

• Thermal Conductivity: 0.67 W/m·K

• Viscosity: 542,000 mPa·s

• Dielectric Strength: 210 V/mil

• Volume Resistivity: 2 × 10¹⁵ ohm·cm

• Shelf Life: Approximately 60 months at 38°C